Among the semiconductor and microelectronics industries, a trend to vertically stack integrated circuits has emerged as a viable solution for meeting electronic device requirements. Vertical stacking of integrated circuits (ICs) or circuitry is becoming increasingly popular. The numerous methods and processes utilized to accomplish this are collectively referred to as 3D integration technologies.
Advantages of 3D Integrated Circuits
When it comes to VLSI design, the overall construction of a 3D integrated circuit is very straightforward. It is possible to manufacture integrated circuits using this technology by stacking feature layers on top of one another. A shorter distance between two circuits can be achieved by stacking individual die/wafer layers vertically, reducing the length of the connection necessary to convey an electrical signal between them. The lower link length facilitates the advantages of 3D integrated circuits.
- Lower Electricity Consumption
Since the late 1990s, lower power consumption has prompted smaller package sizes, and new interconnect designs, among other things. At some point, the only method to achieve reduced package sizes in an integrated circuit was to stack the design in three dimensions.
- More rapid signal transitions
Because vertical interconnects are shorter than horizontal interconnects in these designs, the total capacitance of a vertical interconnect is smaller than that of a horizontal interconnect. This means that signals in interconnects will have a shorter RC time constant and will transition between ON and OFF states more quickly.
- Integration of Analog and Digital Signals
Integration of analogue and digital circuit blocks into the same device with fewer signal integrity concerns and without considerably increasing the package size is made possible by 3D integration. The digital and analogue blocks can be segregated in these packages and arranged in a planar configuration.
- Savings of space
Finally, the most evident advantage is the reduced storage space required due to the reduced package sizes. It is possible to keep the thickness of vertically stacked 3D integrated circuits extremely low, which is advantageous compared to spreading circuit blocks out over the entire surface area of a semiconductor die.
As packaging technology advances, it is projected that this form of integration will become increasingly common.
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